Process capability

Process capability

Process capability

制程能力及检测参数 Process capability and checking parameters
ITEM				Technical capabilities
层次 Layers				2-64layers
最大尺寸 Max.Board Size				1200mm*610mm
				79"*24"
板厚 Finished Board Thickness				0.15mm--10.0mm
				0.01"--0.4"
铜厚 Finished Copper Thickness				17um-420um
				0.5OZ--12OZ
最小线宽/线距 Min.Trace Width/Space				0.075mm/0.065mm
				0.003"/0.0026"
最小孔径 Min.Hole Size				0.1mm
				0.006"
PTH孔孔径差 Hole Dim. Tolerance(PTH)				±0.05mm
				±0.002"
NPTH孔孔径差 Hole Dim.Tolerance(NPTH)				±0.05mm
				±0.002"
孔位公差 Drill Location Tolerance				±0.05mm
				±0.002"
V-CUT角度 V-Score Degrees				20-90度
				/
最小V-CUT板厚 Min.V-Score PCB Thickness				0.25mm
				0.01"
外型公差 CNC Routing Tolerance				±0.1mm
				±0.004"
最小盲/埋孔 Min.Blind/Buried Via				0.1mm
				0.0039"
塞孔 Plug Hole Size				0.2mm--0.5mm
				0.008"--0.02"
最小BGA Min.BGA PAD				0.2mm
				0.008"
材质 Materials				FR4板（指定品牌物料：如建滔、生益、联茂、南亚、台光台耀等)、高频板、铁氟龙板、陶瓷板、罗杰斯板等等
				FR4 (designated brand materials: such as KB, Shengyi, ITEQ, NANYA, EMC, TUC and so on), high frequency board, Teflon board, ceramic board, Rogers board and so on
表面处理 Surface Finish				沉金/防氧化/镀金 (软/硬) /喷锡/沉银沉锡/镀锡/碳油/金手指
				immersion gold/OSP/plating Gold (soft/hard) /hot air leveling (HASL)/immersion Silver/immersion Tin/plating Tin/Carbon ink/Gold-finger
翘曲度 Warp&Twist				≤0.75%

通断测试 Electrical Testing				50--300V

可焊性试验 Solderability Testing				245±5℃,3sec Wetting area least95%
热冲击试验 Thermal Cycling Testing				288±5℃,10sec,3cycles
离子污染测试 Ionic Contamination Testing				Pb,Hg,Cd,Cr(VI),PBB,PBDE六项均小等于1000ppm
				Pb,Hg,Cd,Cr(VI),PBB,PBDE six items are less than 1000ppm
附着力测试 Soldmask Adhesion Testing				260℃+/-5,10S，3times
特殊工艺 Special Technology				semicircular notch board、high TG board、mixed dielectric substrates、halogen free board、ultra thin/ultra thick board 、bonding、solder resistpeelable mask、carbon oil、electric thick gold plating、ENEPIG、plating gold finger、blind routing、buried via board/blind hole board、counter boring resin plug hole、regid flex board、HDI.

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